[citation][nom]maestintaolius[/nom]Doesn't work very well, the graphene doesn't conduct heat well on the z-axis, similar to boron nitride and graphite (to make TIMs with those you usually rely on conglomerates so the x-y-z planes are randomly oriented giving you an overall thermal conductivity). We use it some of our thermal materials but we orient it so the heat travels from the device to the sink along the x-y axis. But, to do that we have to align/form the sheets in place and that's very expensive, we typically use it for high end, high cost projects where copper's thermal conductivity is not sufficient. Another problem is its non-conforming, meaning it doesn't fill in the micro-structure of the heat sink and chip surface (like greases and pads do), so even though your thermal conductivity is high, your interfacial resistance is through the roof (in the case where we use pyrolytic graphite or graphene systems we still need a grease or pad to provide a good interface between the device and sink). And finally, it's not electrically isolating, which may or may not be a problem depending on the device.[/citation]
Oh thank you!
Yea I was wondering if this was the case looking at the structure of graphene. So then it does only act on a plane...
Say do you know if carbon coating is possible as a post machining process? At my last company, we used to send out a lot of parts to get coated for use as sputtering targets and for hot isostatic press.